基于LTCC的毫米波天线设计

论文总字数：40054字

摘 要

随着人类社会信息化进程的加快，电磁频谱的应用范围日益扩大。近年来, 毫米波领域已经成为国际电磁波频谱资源研究的一个极其活跃的领域。同时，随着电子工业技术的发展，对天线的小型化要求愈来愈高，LTCC (Low-Temperature Co-fired Ceramic，低温共烧陶瓷)以其在毫米波频段优良的高热传导率、高耐温性、高频高品质因数、低介质损耗特点，能减小毫米波的传输损耗、缩小天线体积从而满足小型化的要求。因此，本文针对基于LTCC技术的毫米波阵列天线进行了研究和设计。

论文首先介绍了LTCC技术的特点、工艺流程及其与PCB技术相比的优点，以及国内外微波毫米波LTCC天线的发展历史及研究现状。然后，通过对微带天线基本理论的分析，针对LTCC天线的多层结构，采用了矩形、蝶形及E形三种宽带的辐射贴片形式和H型、沙漏型两种缝隙耦合馈电形式实现宽带阵列。之后，对宽带阵列天线形式基于PCB技术进行了验证设计，完成了Ka波段2×4微带天线阵列和8×8微带天线阵列设计、加工和实物测试，测试结果与仿真结果吻合良好，验证了设计原理与设计方法的正确性。最后设计了基于LTCC技术的Ka波段8×8微带天线阵列，实现天线阵列反射损耗小于-10dB的阻抗带宽为33.3GHz~35.7GHz（相对阻抗带宽为7%），天线增益为23.0dBi，各项性能满足设计指标要求。

关键词： LTCC，毫米波天线，微带天线，带状线，缝隙耦合

Design of Millimeter Wave Antenna Based on LTCC

04014033 Lianwei Zhang

Advisor：Hongfu Meng

Abstract

With the acceleration of the human social informatization process, the application of electromagnetic spectrum is expanding. In recent years, the millimeter wave field has become an extremely active field in the study of international electromagnetic spectrum resources. At the same time, with the development of electronic industry technology, the requirements for miniaturization of antennas are becoming higher and higher, and LTCC (Low-Temperature Co-fired Ceramic) is excellent in its high thermal conductivity and high resistance in the millimeter wave band. The characteristics of temperature, high frequency, high quality factor and low dielectric loss can reduce the transmission loss of millimeter wave and reduce the antenna volume to meet the requirements of miniaturization. Therefore, this paper studies and designs the millimeter-wave array antenna based on LTCC technology.

The paper first introduces the characteristics of LTCC technology, process flow and its advantages compared with PCB technology, and the development history and research status of microwave millimeter-wave LTCC antenna at home and abroad. Then, based on the analysis of the basic theory of the microstrip antenna, three types of rectangular patch, butterfly and E-shaped radiation patches and two slot-coupled feed patterns of H and hourglass are adopted for the multilayer structure of the LTCC antenna. Implement a broadband array. Afterwards, the design of broadband array antenna based on PCB technology was verified and verified. The design, processing and physical test of Ka band 2×4 microstrip antenna array and 8×8 microstrip antenna array were completed. The test results were in good agreement with the simulation results. The correctness of design principles and design methods. Finally, a Ka band 8×8 microstrip antenna array based on LTCC technology is designed to achieve an antenna array with a reflection loss of less than -10 dB and an impedance bandwidth of 33.3 GHz to 35.7 GHz (with a relative impedance bandwidth of 7%), and an antenna gain of 23.0 dBi. Item performance meets design index requirements.

KEY WORDS: LTCC，millimeter wave antenna，microstrip antenna，stripline,，slot coupling

目 录

摘要 ········································································································Ⅰ

Abstract·······································································································Ⅱ

第一章 绪论··································································································1

1.1 研究背景······························································································1

1.1.1毫米波系统及天线的应用··································································1

1.1.2系统对天线小型化的需求··································································1

1.2 LTCC简介···························································································1

1.3 国内外微波毫米波LTCC天线发展动态·······················································3

1.4本文研究目标及论文的内容安排·································································5

第二章 微带天线基本理论················································································7

2.1 带状线·································································································7

2.2 微带线·································································································7

2.3 微带天线······························································································8

2.3.1 微带贴片天线辐射原理····································································8

2.3.2 微带缝隙耦合贴片天线基本原理························································9

2.3.3 基于带状线的缝隙耦合贴片天线························································9

2.4 本章小结·····························································································10

第三章 基于PCB材料的毫米波微带天线设计······················································11

3.1 天线单元理论设计·················································································11

3.1.1 辐射贴片尺寸的确定······································································11

3.1.2 馈线特性阻抗、馈线宽度及馈电位置的确定········································13

3.1.3 缝隙尺寸的确定············································································13

3.1.4 接地板尺寸的确定·········································································13

3.2 天线单元仿真设计·················································································14

3.3 馈电网络设计·······················································································16

3.3.1 阵列天线的馈电方式······································································16

3.3.2 功分器的基本原理·········································································16

3.3.3 子馈电网络设计············································································18

3.3.4 全馈电网络设计············································································21

3.4天线阵设计···························································································22

3.4.1 子阵列设计··················································································22

3.4.2 全阵列设计··················································································27

3.5天线加工与测试·····················································································28

3.6 本章小结·····························································································30

第四章 基于LTCC材料的毫米波微带天线设计····················································31

4.1 天线单元设计·······················································································31

4.1.1基于矩形贴片和H型缝隙的天线单元设计···········································31

4.1.2基于蝶形贴片和H型缝隙的天线单元设计···········································33

4.1.3基于E形贴片和H型缝隙的天线单元设计···········································35

4.1.4基于矩形贴片和沙漏型缝隙的天线单元设计·········································36

4.2 馈电网络设计··························································································38

剩余内容已隐藏，请支付后下载全文，论文总字数：40054字