论文总字数：23224字

摘 要

MEMS压力传感器体积小、能耗低、重量轻、易于批量生产，被广泛使用于生产、生活诸多领域。如何有效较低产品成本、缩短产品研发周期，成为MEMS器件和系统设计开发中非常重要的环节。近年来，人们逐渐重视MEMS器件的可靠性设计。MEMS器件在运输和使用中可能会受到机械冲击，在有些测量使用场合中不可避免的冲击。超过一定程度的冲击会使MEMS器件失效，冲击成为影响器件可靠性的重要因素之一。有美国研究人员通过大量实验数据来研究MEMS器件在冲击下的可靠性，但从理论上进行分析和研究的仍然不多。MEMS压力传感器作为研究和使用非常成熟的MEMS器件，储运、测量中难免受到不同程度的意外冲击和碰撞。很有必要从理论上分析MEMS 压力传感器的可靠性，并建立数学模型，为设计提供参考依据。

为应对MEMS压力传感器冲击可靠性的研究不足造成其广泛应用上的障碍，来探讨压力传感器受到冲击后对其封装及性能的影响，明确MEMS压力传感器在冲击作用下的响应、可能出现的失效模式和产生条件，开展相关研究。把压力传感器的典型结构膜片结构作为研究重点，用小挠度理论的线性原则及压力传感器失效理论的分析，在厚度一定的情况下将膜片的边长作为变量，通过ANSYS有限元分析软件，来探究膜片的外形设计对压力传感器膜片性能的影响。

关键词：MEMS压力传感器，可靠性，冲击，膜片，有限元分析

SHOCK IMPACT RELIABILITY ANALYSIS OF MEMS PRESSURE SENSOR

Abstract

MEMS pressure sensor has a lot of advantages,such as the small size, low energy consumption, light weight, easy mass production.It is widely used in many fields of production and life, but how to effectively lower the cost of products, shorten the product development cycle, has become a very important part in the design and development of MEMS devices and systems. In recent years, people pay more and more attention to the reliability design of MEMS devices. MEMS devices may be mechanically impacted in the transportation and use, and in some cases the inevitable impact of the measurement. More than a certain degree of impact will make the MEMS devices fail, and the impact is one of the important factors that affect the reliability of the device. Researchers in the United States through a large number of experimental data to study the impact of MEMS devices under the impact of reliability, but the theoretical analysis and research is still not much. MEMS pressure sensor as the research and use of very sophisticated MEMS devices, storage and transportation, measurement is subject to varying degrees of unexpected impact and collision. It is necessary to analyze the reliability of the MEMS pressure sensor in theory and establish the mathematical model to provide reference for the design.

In response to the reliability of the MEMS pressure sensor impact the obstacle of the inadequate research on its wide application, to explore the pressure sensor after the impact of its packaging and performance, the influence of clear MEMS pressure sensor response under the impact and possible failure modes and conditions, to carry out the related research. The pressure sensor as a research focus, the typical structure of diaphragm structure with small deflection theory of linear principle and the analysis of the pressure sensor failure theory, in the case of a certain thickness to the length of the diaphragm as variables, through the finite element analysis software ANSYS, to explore the shape and size of the diaphragm effect the performance of the pressure sensor diaphragm.

KEY WORDS: MEMS Pressure Sensor, Reliability, Impact, Diaphragm, Finite Element Analysis

目录

摘 要 I

Abstract II

第一章 绪 论 1

1.1 课题背景 1

1.2 MEMS压力传感器的发展和分类 3

1.3 可靠性技术概括 5

1.4 课题内容及论文安排 6

第二章 压力传感器冲击可靠性研究的理论建立 9

2.1 压力传感器的失效模式和失效机理 9

2.1.1 失效模式 9

2.1.2 失效机理 11

2.2 断裂失效 13

2.2.1 器件的断裂失效现象 13

2.2.2 断裂失效机理 14

2.2.3 强度理论 15

2.3 压阻式压力传感器 16

2.3.1 硅的压阻效应 16

2.3.2 大挠度与小挠度理论 18

第三章 有限元仿真实验 23

3.1 膜片的描述 23

3.2 冲击载荷的描述 24

3.3 建模过程 24

3.4 仿真结果 28

第四章 总结与展望 39

4.1 工作总结 39

4.2 工作展望 39

致谢 40

参考文献 41

第一章 绪 论

1.1 课题背景

MEMS(Micro electric-mechanical System微电机械系统)一词第一次出现在人们眼前，是在1989在美利坚合众国举办的全球微机械加工技术讨论大会的总结报告“Microelection Technology applied to Electrical Mechanical System”中，经过本次会议的研讨，美国的先进技术署认为微机械加工技术必然成为以后最关键的技术，并确实提出了发展该技术的计划。从那一刻起，MEMS技术开始快速的发展并为人们所知。^[16]

MEMS压力传感器是集成的微型系统，它结合了电子、机械、磁、液体和热等元件通常采用传统的半导体批量工艺技术来制造，其尺寸范围从几纳米到几微米甚至毫米不等。这些系统的敏感或者执行模式被设计为外部环境相互作用，从而产生状态信息对外部环境进行控制。

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